Intel is advancing its U.S. semiconductor manufacturing expansion, with equipment installation underway at Arizona's Fab 62 ...

As AI workloads demand greater memory capacity, chipmakers are exploring alternatives to traditional memory architectures.

Uncertainty is growing over potential delays to Google’s TPU v9. Industry sources point to the HumuFish variation as a key area of concern: reported ...

NVIDIA is advancing its next-generation co-packaged optics (CPO) technology, with prototypes designed to bring optical engines closer to computing ...

Samsung Electronics is preparing to expand the use of its in-house processors in its next-generation flagship smartphones.

Apple is expanding its U.S. manufacturing footprint, bringing more domestically sourced components into its latest iPhone ...

China's semiconductor equipment makers are stepping up their push into advanced packaging as demand grows for technologies ...

Intel is expanding its silicon photonics capabilities as demand for high-bandwidth optical interconnects grows across AI and ...

Ahead of its October 31 earnings release, CXMT forecast revenue of RMB 265–270 billion for the first nine months of 2026, ...

As previously reported by ZDNet in September, Samsung is pursuing a dual-track strategy for custom HBM, tapping both its own ...

The memory industry faces growing concerns over technological advances by Chinese rivals, potential HBM specification changes ...

As AI-driven demand extends from DRAM to NAND, Samsung and SK hynix are upgrading their key Chinese facilities. According to Reuters, Samsung plans ...